An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters

Details An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters

2008-02-21

arxiv.org/abs/0802.3062v1

Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)

Computer Science

Other Computer Science

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

Scientific paper

An original packaging method suitable for integrated thermal mass flow sensors is presented. The method consists in the application of a plastic transparent adapter to the chip surface. The adapter is sealed to the chip surface by means of a thermal procedure. By this approach it is possible to selectively convey the fluid flow to reduced chip areas, avoiding contact with the pads. Fabrication and testing of a very compact flow sensor is described.

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