A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test

Details A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test A Stress Analysis of Large-Size Plastic Encapsulated Microelectronics with Thermal Cycle Test

Jul 1997

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1997esasp.395..417m&link_type=gif

Electronic Component Conference - EECC'97, Proceedings of the 3rd ESA Electronic Component Conference held 22-25 April, 1997 at

Computer Science

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