A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package

Details A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package

2008-02-21

arxiv.org/abs/0802.3057v1

Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)

Computer Science

Other Computer Science

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

Scientific paper

In this work, we present a fully parameterized capped transmission line model for electromagnetic optimization of a wafer level package (WLP) for RF MEMS applications using the Ansoft HFSS-TM electromagnetic simulator. All the degrees of freedom (DoF's) in the package fabrication can be modified within the model in order to optimize for losses and mismatch (capacitive and inductive couplings) introduced by the cap affecting the MEMS RF behaviour. Ansoft HFSS-TM was also validated for the simulation of capped RF MEMS devices by comparison against experimental data. A test run of capped 50 transmission lines and shorts was fabricated and tested.

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