3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation

Details 3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation 3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation

2007-11-21

arxiv.org/abs/0711.3277v1

Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

Computer Science

Other Computer Science

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

MEMS devices are typical systems where multiphysics simulations are unavoidable. In this work, we present possible applications of 3-D self-assembled SOI (Silicon-on-Insulator) MEMS such as, for instance, thermal actuators and flow sensors. The numerical simulations of these microsystems are presented. Structural and thermal parts have to be strongly coupled for correctly describing the fabrication process and for simulating the behavior of these 3-D SOI MEMS.

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