Computer Science – Performance
Scientific paper
Jan 2002
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002aipc..608..250g&link_type=abstract
SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM- STAIF 2002. Conference on Thermophyiscs in Microgravity; Conference on In
Computer Science
Performance
Thermal Radiation, Spaceborne And Space Research Instruments, Apparatus, And Components, Heat Engines, Heat Pumps, Heat Pipes, Microcircuit Quality, Noise, Performance, And Failure Analysis
Scientific paper
NASA requirements and subsequent technology solutions for high heat flux electronics are generally different that those for the terrestrial applications. Unlike terrestrial operations. NASA spacecraft have limited opportunities for air cooling, for example, and must rely on less efficient thermal radiation to reject heat to space. The terrestrial commercial electronics industry, as well as other Government agencies, is investing in advanced technologies for electronics cooling at the microscale. This paper gives a brief summary of metrics used in high heat flux electronics cooling, the difference between solutions developed for terrestrial requirements and those for space, and a short description of challenges as well as possible solutions for space-based high heat flux electronics cooling. The argument is made that high heat flux electronics cooling is indeed a core technology required by NASA, since the thermal and other environmental requirements are unique to NASA space missions and are not addressed by current terrestrial electronics cooling technology development projects. .
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