4. Physics
  5. Condensed Matter
  6. Materials Science

Qiang Yu

Physics – Condensed Matter – Materials Science

Scientist

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New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors

Physics – General Physics
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Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors

Physics – Condensed Matter – Materials Science
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Profile ID: LFWR-SCP-P-52470

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